12kw Heat Power Plastic Molds Temperature Controller

  • Model NO.: MCTW-12
  • Heating Power: 12kw
  • Transport Package: Wooden Package
  • Origin: China
  • Control Temerature Range: Environment Temp. to 100 Centigrade
  • Trademark: SHICA
  • Specification: 750*400*700mm
Mould Temperature Controller 
12kw Heat Power Plastic Molds Temperature Controller

 
FEATURES:
*The temperature control adopted Japanese. Germany,Taiwan.Precise and reliable,
  if can control within +- 1ºC and save electricity over 35%.
*Two sets of electric heater cylinder made from stainless steel.
*Emplaying supeb imported components,with longer terms of service.
*Rapid heating and cool off speeds,temp kept stable at times.
*Complete with safety protection and indication system.
*PLC control panel
 
Specifications Water Type Oil Type
Model MTCW-3 MTCW-6 MTCW-9 MTCW-12 MTCO-3 MTCO-6 MTCO-9 MTCO-12 MTCOH-6 MTCOH-12
Control Temp. Range Environment Temp. to 100ºC Environment Temp. to 160ºC Environment Temp.  to 200ºC
Voltage 3PHASE  380v   50Hz or 60Hz 3PHASE  380v   50Hz or 60Hz
Cooling Methold Direct Cooling Indirect Cooling
Fluid Clean Water Heat Transfer Oil
Heating Capacity KW 3 6 9 12 3 6 9 12 6 12
Pump Power 0.375 0.375 0.375 0.75 0.375 0.375 0.375 0.75 0.375 0.75
Flow Volume(L/MIN) 80 80 80 110 60 60 60 90 60 90
Cooling Water Pipe/inch 1/2 1/2 1/2 1/2 1/2 1/2 1/2 1/2 1/2 1/2
Process Fluid Pipe/inch 1/2*4 1/2*4 1/2*6 1/2*8 1/2*4 1/2*4 1/2*6 1/2*8 1/2*4 1/2*8
Dimension L*W*H(mm) 650*340*580 650*340*580 650*340*580 750*400*700 650*340*580 650*340*580 750*400*700 750*400*700 650*340*580 750*400*700
Weight 54 54 72 90 58 58 75 95 58 75

Panasonic provides extremely dependable electronics assembly equipment in the areas of SMT (surface mount technology), PTH (pin through-hole), and processes involving microelectronics back-end packaging of any-mix circuit manufacturing. We offer first-class equipment ranging from screen printers and dispensing, through component placement and inspection, up to axial and radial insertion, die bonding, die attach and flip chip. Our equipment is used all around the world to enable the production of the most modern technology.

Our variable machines in modular format support a large range of technologies and, from the installation of just one machine through to assemblies of over 1,000, can take care of processes such as, COB (chip on board), SOP (system on package), epoxy die attach, POP (package on package), 3D packaging, TS (thermo-sonic) and TC (thermo-compression) processing, plasma RIE surface cleaning, plasma ICP etching, and thin wafer plasma dicing. To perform odd-form placement and end-of-line work, we also offer automated equipment.

Panasonic Chip Mounter

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Shenzhen Keith Electronic Equipment Co., Ltd. , https://www.aismtks.com

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